Rigid PCB Solutions
Electronic Components Marketing Group
At ECMG, our clients come to us in need of rigid printed circuit boards (PCBs) for a variety of reasons. One of the main reasons is cost. A rigid PCB is the most common component in electronic assembly. Unlike flex PCBs, a rigid PCB cannot be twisted or bent, but instead is built with a rigid fiberglass layer that gives it extra strength.
Rigid PCBs are made of copper foil layers laminated between a solid fiberglass substrate with copper tracks and component layouts. They also have a solder mask layer that adds insulation to the copper and a silkscreen layer which is used for component placement and other nomenclature.
Depending on your needs, a rigid PCB may be the right solution for you. Use the buttons below to request a quote or learn more about your PCB options.
Rigid PCB Capabilities
Items | Mass | Sample | |||||||||||
Layers | 2-68L | Up to 120L | |||||||||||
Max. Board Thickness | 10mm(394mil) | 14mm(551mil) | |||||||||||
Min. Width/Space | Inner Layer | 50/50um | 40/40um | ||||||||||
Outer Layer | 65/65um | 50/50um | |||||||||||
Registration | Same Core | ±25um | ±20um | ||||||||||
Layer to Layer | ±4.5mil | ±4mil | |||||||||||
Max. Copper Thickness | 6oz | 30oz | |||||||||||
Min. Drill Hole Diameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) | ||||||||||
Laser | 0.1-0.35mm | 0.05-0.35mm | |||||||||||
Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX570mm | ||||||||||
Backplane | 1250mmX570mm | 1320mmX570mm | |||||||||||
Aspect Ratio (Finish Hole) | Line-card | 20:1 | 27:1 | ||||||||||
Backplane | 25:1 | 32:1 | |||||||||||
Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF | |||||||||||
High Speed | Megtron4, TU872SLK, FR408HR,N4000-13 Series, S7439C,TU863+, Megtron6, MW2000, IT968,EM891, Megtron7,MW4000,TU933,DS7409DVN,IT988GSE | ||||||||||||
High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series,AD series,RT6002 | ||||||||||||
Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,ST115 | ||||||||||||
Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG 20 |
Products | 2019 | 2020 | 2021 | ||||||||||
Mass | Sample | Mass | Sample | Mass | Sample | ||||||||
Backplane | Layers | 2-68L | Up to 120L | 2-68L | Up to 120L | 2-68L | Up to 120L | ||||||
Finish Size | 1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | |||||||
Board Thickness | 10mm | 14mm | 10mm | 14mm | 10mm | 14mm | |||||||
Aspect Ratio(0.31mmFinishHole | 25:1 | 32:1 | 25:1 | 35:1 | 30:1 | 35:1 | |||||||
Aspect Ratio(0.36Finish Hole) | 27:1 | 33:1 | 27:1 | 33:1 | 27:1 | 33:1 | |||||||
Line-card | Layers | 32 | 36 | 36 | 36 | 36 | 36 | ||||||
Width/Space(Outer Layer) | 3mil/3mil | 2.5mil/2.5mil | 3mil/3mil | 2.5mil/2.5mil | 3mil/3mil | 2.5mil/2.5mil | |||||||
Width/Space(Inner Layer) | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | |||||||
Aspect Ratio(0.15mmFinish Hole | 20:1 | 25:1 | 22:1 | 25:1 | 22:1 | 25:1 | |||||||
Aspect Ratio(0.20mmFinish Hole) | 21:1 | 27:1 | 24:1 | 27:1 | 25:1 | 27:1 | |||||||
Impedance Tolerance | ±7% | ±5% | ±5% | ±5% | ±5% | ±5% |
Contact Us
Fill Out The Form Below To Contact Us