Flexible PCB Solutions
Electronic Components Marketing Group
Our clients come to us in need of flexible PCBs for a number of reasons. Some of these include the need for enhanced capabilities, 
reliability, and the ability to save space. A flex PCB is comprised of a layer of copper that is bonded to a layer of coverlay material. Flexible Circuits are intended to provide a flexible interconnect so that they can move, curve or bend in installation. These circuits are great when space is limited, or movement of the circuit is required.
Depending on your needs, a flex PCB may be the right solution for you. Use the buttons below to request a quote or learn more about your PCB options.
Capabilities
Flex PCBs
| Technical Specification | ||
| Number Of Layer | Flexible 1~8 | |
| Material | PI PET FR-4 BT | |
| Copper Thickness | 1/3oz 1/2oz 1oz max 2oz | |
| Min Board thickness | 2mil | |
| Max. Board Thickness | 126mil | |
| Max Panel Size | 18 X 24inch (460mm x 616mm) | |
| Single Sided | 2mil / 2mil | |
| Double Sided | 3mil / 3mil | |
| Min. Trace Wide | 4 Layers | 3mil / 3mil |
| &Line Space | 6 Layers | 3mil / 3mil |
| 8 Layers | 3mil / 3mil | |
Min. Hole Diameter | Drilling /shadow | φ0.05mm(2mil) |
| Punching | φ0.30mm(12mil) | |
| Hole Position | ±0.050 ( 2 mil ) | |
| Conductor Width (W) | ±10% | |
| Dimension | Hole Diameter (H) | ±0.03 mm ( 1.2 mil ) |
| Tolerance | [ With PTH ±0.05 mm ( 2 mil ) ] | |
| Outline Dimension | ±0.10 mm ( 4 mil ) | |
| Conductors & Outline | ±0.10 mm ( 4 mil ) | |
| (C-O) | ||
| Surface Treatment On Land Area | Flash Gold/ Immersion Gold/ Pure Tin Plating/Entek | |
| Insulation Resistance | 10KΩ~20MΩ(typical:5MΩ) | |
| Coverlay Continuity | 1.08KG/cm2 | |
| Test voltage | 300V(max) | |
| 0.30-1.60 | 0.10mm (4mil) | |
| 1.61-6.50 | 0.15mm (6mil) | |
Minimum spacing between hole edge to circuitry pattern | PTH hole: 0.13mm (5mil) | |
| NPTH hole: 0.18mm (7mil) | ||
Image transfer Registration tolerance | Circuit pattern vs. index hole | ±0.075 (3mil) |
| Circuit pattern vs. 2nd drill hole | ±0.075 (3mil) | |
| Registration tolerance of front/back image | Front image vs. back image | 0.05mm (2mil) |
Multilayer | Layer-layer misregistration | 4layers:0.05mm (2mil) max. |
| 6layers:0.05mm (2mil) max. | ||
| 8layers:0.07mm (3mil) max. | ||
| Min. spacing between board outline to circuitry pattern of an inner-layer | 0.10mm (4mil) | |
| Impedance control | Typical: 50Ω+/-10% | |
Flex & Rigid Flex PCBs
Items | 2017 | 2018 | 2019 | ||||||
| Mass | Sample | Mass | Sample | Mass | Sample | ||||
Layers | FPC | 6 | 10 | 8 | 10 | 8 | 10 | ||
Rigid-Flex | flexible part | 18 | 20 | 20 | 24 | 24 | 28 | ||
| Total | 22 | 30 | 24 | 30 | 28 | 32 | |||
| Min. CCL thickness (um) | 50 | / | 50 | / | 50 | / | |||
| Min. FCCL thickness(um) | 25 | 12.5 | 12.5 | / | 12.5 | / | |||
| Min. Copper thickness of FCCL (um) | 12 | 9 | 9 | / | 9 | / | |||
Min. thickness (mm) | Double side FPC | 0.13 | 0.11 | 0.11 | 0.09 | 0.09 | / | ||
| 4 layers Rigid-flex | 0.26 | / | 0.26 | / | 0.26 | / | |||
Line width (um) | Inner layer(Hoz) | 65/65 | 50/60 | 50/60 | 50/50 | 50/50 | 40/50 | ||
| Outer layer(Hoz+plating) | 75/75 | 65/75 | 65/75 | 60/60 | 60/60 | 50/50 | |||
| Registration (um) | 114 | 100 | 100 | 89 | 100 | 75 | |||
Min. Hole(mm) | Min Mechanical Drill | 0.15 | 0.10 | 0.10 | / | 0.10 | / | ||
| Min Laser Drill | 0.1 | 0.05 | 0.089 | 0.05 | 0.089 | 0.025 | |||
Structure | Symmetric | M | / | M | / | M | / | ||
| Asymmetric | M | / | M | / | M | / | |||
| Impedance control | +10% | +8% | +10% | +8% | +/-10% | +/-7% | |||
| FPC routing tolerance(mm) | +0.1 | +0.05 | +0.1 | +0.05 | +0.1 | +0.05 | |||
| Finish | HASL/Immersion gold/Immersion silver/Immersion tin/OSP/ENEPIG | ||||||||
High speed FPC | Dupont TK | M | / | M | / | M | / | ||
| LCP | M | / | M | / | M | / | |||
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