Flexible PCB Solutions

Electronic Components Marketing Group

Flexible PCB

Our clients come to us in need of flexible PCBs for a number of reasons. Some of these include the need for enhanced capabilities, reliability, and the ability to save space. A flex PCB is comprised of a layer of copper that is bonded to a layer of coverlay material. Flexible Circuits are intended to provide a flexible interconnect so that they can move, curve or bend in installation. These circuits are great when space is limited, or movement of the circuit is required.

Depending on your needs, a flex PCB may be the right solution for you. Use the buttons below to request a quote or learn more about your PCB options.

Capabilities

Technical Specification
Number Of LayerFlexible 1~8
MaterialPI PET FR-4 BT
Copper Thickness1/3oz 1/2oz 1oz max 2oz
Min Board thickness2mil
Max. Board Thickness126mil
Max Panel Size18 X 24inch (460mm x 616mm)
 Single Sided2mil / 2mil
 Double Sided3mil / 3mil
Min. Trace Wide4 Layers3mil / 3mil
&Line Space6 Layers3mil / 3mil
 8 Layers3mil / 3mil
Min. Hole Diameter
Drilling /shadowφ0.05mm(2mil)
Punchingφ0.30mm(12mil)
 Hole Position±0.050 ( 2 mil )
 Conductor Width (W)±10%
Dimension
Hole Diameter (H)
±0.03 mm ( 1.2 mil )
Tolerance[ With PTH ±0.05 mm ( 2 mil ) ]
 Outline Dimension±0.10 mm ( 4 mil )
 Conductors & Outline
±0.10 mm ( 4 mil )
 (C-O)
Surface Treatment On Land AreaFlash Gold/ Immersion Gold/ Pure Tin Plating/Entek
Insulation Resistance10KΩ~20MΩ(typical:5MΩ)
Coverlay Continuity1.08KG/cm2
Test voltage300V(max)
 
0.30-1.600.10mm (4mil)
1.61-6.500.15mm (6mil)
Minimum spacing between hole edge to circuitry pattern
PTH hole: 0.13mm (5mil)
NPTH hole: 0.18mm (7mil)
Image transfer Registration tolerance
Circuit pattern vs. index hole±0.075 (3mil)
Circuit pattern vs. 2nd drill hole±0.075 (3mil)
Registration tolerance of front/back imageFront image vs. back image0.05mm (2mil)
Multilayer
Layer-layer misregistration
4layers:0.05mm (2mil) max.
6layers:0.05mm (2mil) max.
8layers:0.07mm (3mil) max.
Min. spacing between board outline to circuitry pattern of an inner-layer0.10mm (4mil)
Impedance controlTypical: 50Ω+/-10%

Items
201720182019
MassSampleMassSampleMassSample
Layers
FPC610810810
Rigid-Flex
flexible part182020242428
Total223024302832
Min. CCL thickness (um)50/50/50/
Min. FCCL thickness(um)2512.512.5/12.5/
Min. Copper thickness of FCCL (um)1299/9/
Min. thickness (mm)
Double side FPC0.130.110.110.090.09/
4 layers Rigid-flex0.26/0.26/0.26/
Line width (um)
Inner layer(Hoz)65/6550/6050/6050/5050/5040/50
Outer layer(Hoz+plating)75/7565/7565/7560/6060/6050/50
Registration (um)1141001008910075
Min.
Hole(mm)
Min Mechanical Drill0.150.100.10/0.10/
Min Laser Drill0.10.050.0890.050.0890.025
Structure
SymmetricM/M/M/
AsymmetricM/M/M/
Impedance control+10%+8%+10%+8%+/-10%+/-7%
FPC routing tolerance(mm)+0.1+0.05+0.1+0.05+0.1+0.05
FinishHASL/Immersion gold/Immersion silver/Immersion tin/OSP/ENEPIG
High speed FPC
Dupont TKM/M/M/
LCPM/M/M/

Capabilities

click through any of the buttons below to see their full capabilities matrix

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