Multilayer PCBs
Electronic Components Marketing Group
Multilayer PCBs are made up of four or more conductive copper foil layers. This allows for a high level of circuit complexity and higher assembly density (thus saving space in your device).
Our Manufacturing partners at ECMG possess the capability to produce multilayer PCBs up to 68 layers. Multilayer PCBs are used in complex and high technology applications with even greater component densities than single and double sided PCBs. These are typically found in telecom, datacom, automotive, medical, instrumentation and controls, consumer electronics, health and fitness applications and many others.
Depending on your device’s needs, multilayer PCBs may be the right solution for you. Use the buttons below to request a quote or learn more about your PCB options.
Capabilities
| Items | Mass | Sample | |||||||||||
| Layers | 2-68L | Up to 120L | |||||||||||
| Max. Board Thickness | 10mm(394mil) | 14mm(551mil) | |||||||||||
Min. Width/Space | Inner Layer | 50/50um | 40/40um | ||||||||||
| Outer Layer | 65/65um | 50/50um | |||||||||||
Registration | Same Core | ±25um | ±20um | ||||||||||
| Layer to Layer | ±4.5mil | ±4mil | |||||||||||
| Max. Copper Thickness | 6oz | 30oz | |||||||||||
Min. Drill Hole Diameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) | ||||||||||
| Laser | 0.1-0.35mm | 0.05-0.35mm | |||||||||||
Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX570mm | ||||||||||
| Backplane | 1250mmX570mm | 1320mmX570mm | |||||||||||
Aspect Ratio (Finish Hole) | Line-card | 20:1 | 27:1 | ||||||||||
| Backplane | 25:1 | 32:1 | |||||||||||
Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF | |||||||||||
| High Speed | Megtron4, TU872SLK, FR408HR,N4000-13 Series, S7439C,TU863+, Megtron6, MW2000, IT968,EM891, Megtron7,MW4000,TU933,DS7409DVN,IT988GSE | ||||||||||||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series,AD series,RT6002 | ||||||||||||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,ST115 | ||||||||||||
| Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG 20 | ||||||||||||
Products | 2019 | 2020 | 2021 | ||||||||||
| Mass | Sample | Mass | Sample | Mass | Sample | ||||||||
Backplane | Layers | 2-68L | Up to 120L | 2-68L | Up to 120L | 2-68L | Up to 120L | ||||||
| Finish Size | 1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | 1250mmX570mm | 1320mmX570mm | |||||||
| Board Thickness | 10mm | 14mm | 10mm | 14mm | 10mm | 14mm | |||||||
| Aspect Ratio(0.31mmFinishHole | 25:1 | 32:1 | 25:1 | 35:1 | 30:1 | 35:1 | |||||||
| Aspect Ratio(0.36Finish Hole) | 27:1 | 33:1 | 27:1 | 33:1 | 27:1 | 33:1 | |||||||
Line-card | Layers | 32 | 36 | 36 | 36 | 36 | 36 | ||||||
| Width/Space(Outer Layer) | 3mil/3mil | 2.5mil/2.5mil | 3mil/3mil | 2.5mil/2.5mil | 3mil/3mil | 2.5mil/2.5mil | |||||||
| Width/Space(Inner Layer) | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | 2.2mil/2.2mil | 2mil/2mil | |||||||
| Aspect Ratio(0.15mmFinish Hole | 20:1 | 25:1 | 22:1 | 25:1 | 22:1 | 25:1 | |||||||
| Aspect Ratio(0.20mmFinish Hole) | 21:1 | 27:1 | 24:1 | 27:1 | 25:1 | 27:1 | |||||||
| Impedance Tolerance | ±7% | ±5% | ±5% | ±5% | ±5% | ±5% | |||||||
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