Capabilities

Electronic Components Marketing Group

ItemsMassSample
Layers2-68LUp to 120L
Max. Board Thickness10mm(394mil)14mm(551mil)
Min. Width/Space
Inner Layer50/50um40/40um
Outer Layer65/65um50/50um
Registration
Same Core±25um±20um
Layer to Layer±4.5mil±4mil
Max. Copper Thickness6oz30oz
Min. Drill Hole Diameter
Mechanical≥0.15mm(6mil)≥0.1mm(4mil)
Laser0.1-0.35mm0.05-0.35mm
Max. Size
(Finish Size)
Line-card850mmX570mm1000mmX570mm
Backplane1250mmX570mm1320mmX570mm
Aspect Ratio (Finish Hole)
Line-card20:127:1
Backplane25:132:1
Material
FR4EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF
High SpeedMegtron4, TU872SLK, FR408HR,N4000-13 Series, S7439C,TU863+, Megtron6, MW2000, IT968,EM891, Megtron7,MW4000,TU933,DS7409DVN,IT988GSE
High FrequencyRo3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series,AD series,RT6002
OthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,ST115
Surface FinishHASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG 20
Products
201920202021
MassSampleMassSampleMassSample
Backplane
Layers2-68LUp to 120L2-68LUp to 120L2-68LUp to 120L
Finish Size1250mmX570mm1320mmX570mm1250mmX570mm1320mmX570mm1250mmX570mm1320mmX570mm
Board Thickness10mm14mm10mm14mm10mm14mm
Aspect Ratio(0.31mmFinishHole25:132:125:135:130:135:1
Aspect Ratio(0.36Finish Hole)27:133:127:133:127:133:1
Line-card
Layers323636363636
Width/Space(Outer Layer)3mil/3mil2.5mil/2.5mil3mil/3mil2.5mil/2.5mil3mil/3mil2.5mil/2.5mil
Width/Space(Inner Layer)2.2mil/2.2mil2mil/2mil2.2mil/2.2mil2mil/2mil2.2mil/2.2mil2mil/2mil
Aspect Ratio(0.15mmFinish Hole20:125:122:125:122:125:1
Aspect Ratio(0.20mmFinish Hole)21:127:124:127:125:127:1
Impedance Tolerance±7%±5%±5%±5%±5%±5%
Technical Specification
Number Of LayerFlexible 1~8
MaterialPI PET FR-4 BT
Copper Thickness1/3oz 1/2oz 1oz max 2oz
Min Board thickness2mil
Max. Board Thickness126mil
Max Panel Size18 X 24inch (460mm x 616mm)
 Single Sided2mil / 2mil
 Double Sided3mil / 3mil
Min. Trace Wide4 Layers3mil / 3mil
&Line Space6 Layers3mil / 3mil
 8 Layers3mil / 3mil
Min. Hole Diameter
Drilling /shadowφ0.05mm(2mil)
Punchingφ0.30mm(12mil)
 Hole Position±0.050 ( 2 mil )
 Conductor Width (W)±10%
Dimension
Hole Diameter (H)
±0.03 mm ( 1.2 mil )
Tolerance[ With PTH ±0.05 mm ( 2 mil ) ]
 Outline Dimension±0.10 mm ( 4 mil )
 Conductors & Outline
±0.10 mm ( 4 mil )
 (C-O)
Surface Treatment On Land AreaFlash Gold/ Immersion Gold/ Pure Tin Plating/Entek
Insulation Resistance10KΩ~20MΩ(typical:5MΩ)
Coverlay Continuity1.08KG/cm2
Test voltage300V(max)
 
0.30-1.600.10mm (4mil)
1.61-6.500.15mm (6mil)
Minimum spacing between hole edge to circuitry pattern
PTH hole: 0.13mm (5mil)
NPTH hole: 0.18mm (7mil)
Image transfer Registration tolerance
Circuit pattern vs. index hole±0.075 (3mil)
Circuit pattern vs. 2nd drill hole±0.075 (3mil)
Registration tolerance of front/back imageFront image vs. back image0.05mm (2mil)
Multilayer
Layer-layer misregistration
4layers:0.05mm (2mil) max.
6layers:0.05mm (2mil) max.
8layers:0.07mm (3mil) max.
Min. spacing between board outline to circuitry pattern of an inner-layer0.10mm (4mil)
Impedance controlTypical: 50Ω+/-10%

Items
201720182019
MassSampleMassSampleMassSample
Layers
FPC610810810
Rigid-Flex
flexible part182020242428
Total223024302832
Min. CCL thickness (um)50/50/50/
Min. FCCL thickness(um)2512.512.5/12.5/
Min. Copper thickness of FCCL (um)1299/9/
Min. thickness (mm)
Double side FPC0.130.110.110.090.09/
4 layers Rigid-flex0.26/0.26/0.26/
Line width (um)
Inner layer(Hoz)65/6550/6050/6050/5050/5040/50
Outer layer(Hoz+plating)75/7565/7565/7560/6060/6050/50
Registration (um)1141001008910075
Min.
Hole(mm)
Min Mechanical Drill0.150.100.10/0.10/
Min Laser Drill0.10.050.0890.050.0890.025
Structure
SymmetricM/M/M/
AsymmetricM/M/M/
Impedance control+10%+8%+10%+8%+/-10%+/-7%
FPC routing tolerance(mm)+0.1+0.05+0.1+0.05+0.1+0.05
FinishHASL/Immersion gold/Immersion silver/Immersion tin/OSP/ENEPIG
High speed FPC
Dupont TKM/M/M/
LCPM/M/M/

Product FeatureTechnology Roadmap
 201720182019
Layer Count (Max)18L20L20L
Laminate & PrepregFR-4, HFFR-4FR-4, HFFR-4 High Speed / Low Loss Megtron 6FR-4, HFFR-4 High Speed / Low Loss Megtron 6
Surface FinishENIG, OSP, Immersion Silver,Immersion Tin, Selective ENIG+OSPENIG, OSP, Immersion Silver,Immersion Tin, Selective ENIG+OSPENIG, OSP, Immersion Silver,Immersion Tin, Selective ENIG+OSP
HDI Level1+N+1 2+N+2 3+N+3 Anylayer1+N+1 2+N+2 3+N+3 Anylayer1+N+1 2+N+2 3+N+3 Anylayer
Max Board Thickness mm(mil)3.2 (126)3.2 (126)3.2 (126)
Min Board Thickness mm(mil)0.4 (16)0.4 (16)0.4 (16)
Min Core Thickness mm(mil)0.05 (2)0.05 (2)0.05 (2)
Min Dielectric Thickness mm(mil)0.05 (2)0.05 (2)0.05 (2)
Min Micro-via Size mm(mil)0.076 (3)0.076 (3)0.076 (3)
Min Microvia Pad Size mm(mil)0.2 (8)0.2 (8)0.2 (8)
Min Mechanical Drill Hole Size mm(mil)0.15 (6)0.15 (6)0.15 (6)
Press-fit Hole Tolerance (mm)±0.05mm±0.05mm±0.05mm
PTH Hole Tolerance (excluding HASL) (mm)±0.05mm±0.05mm±0.05mm
14 NPTH Hole Tolerance (mm)±0.03mm±0.03mm±0.03mm
Hole Plating Aspect Ratio (max)8:019:019:01
Micro-via Aspect Ratio0.85 : 11 : 11 : 1
Min.Line Width & Spacing (mm) (Inner)0.070mm0.064mm0.064mm
Min.Line Width & Spacing (Outer) (mm)0.076mm0.076mm0.076mm
Min Mechanical Via Pad Size mm(mil)0.2 (D+8)0.2 (D+8)0.2 (D+8)
Image to Hole Tolerance mm(mil)±0.076 (3)±0.064 (2.5)±0.064 (2.5)
Hole to Edge Tolerance mm(mil)±0.100 (4)±0.076 (3)±0.076 (3)
Min Solder Mask Bridge mm(mil)0.076 (3)0.076 (3)0.076 (3)
Min Solder Mask Opening mm(mil)0.05 (2)0.05 (2)0.05 (2)
Controlled Impedance±8%±8%±7%
Min BGA Pitch mm(mil)0.45 (18)0.45 (18)0.45 (18)
Min Pad to Pad Dimension Tolerance up to 16”±0.05 (2)±0.05 (2)±0.05 (2)
Min Hole to Copper up to Max Layer Count mm(mil)0.178 (7)0.165 (6.5)0.165 (6.5)
Max. Warpage (Bow&Twist)0.40%0.40%0.40%

Product FeatureTechnology Roadmap
Product Type
201720182019
Single-sided, Silver Through Hole, Copper Through HoleSingle-sided, Silver Through Hole, Copper Through HoleSingle-sided, Silver Through Hole, Copper Through Hole
Laminate TypeFR1, CEM1, CEM3, FR-4, High CTI FR4FR1, CEM1, CEM3, FR-4, High CTI FR4FR1, CEM1, CEM3, FR-4, High CTI FR4
Surface FinishENIG, OSP, HASL, LF HASLENIG, OSP, HASL, LF HASLENIG, OSP, HASL, LF HASL
Max Panel Size mm(inch)520 (20.5) x 610 (24.0)520 (20.5) x 610 (24.0)520 (20.5) x 610 (24.0)
Board Thickness mm (mil)1.6 (63) – Typical 3.2 (126) – Max. 0.8 (32) – Min.1.6 (63) – Typical 3.2 (126) – Max. 0.8 (32) – Min.1.6 (63) – Typical 3.2 (126) – Max. 0.8 (32) – Min.
Copper Foil1/2, 1, 2oz1/2, 1, 2oz1/2, 1, 2oz
7 Min Drill Hole Size mm(mil)0.55 (22) – STH 0.40 (16) – CTH0.55 (22) – STH 0.40 (16) – CTH0.55 (22) – STH 0.40 (16) – CTH
Line Width & Spacing
Screen Print0.20 (8)0.20 (8)0.20 (8)
LPI0.15 (6)0.15 (6)0.15 (6)
Min Via Pad mm(mil)
PunchingD+0.3 (D+12)D+0.3 (D+12)D+0.3 (D+12)
DrillingD+0.25 (D+10)D+0.25 (D+10)D+0.25 (D+10)
Image to Hole Tolerance mm(mil)±0.15 (6)±0.15 (6)±0.15 (6)
Hole to Edge Tolerance mm(mil)±0.15 (6)±0.15 (6)±0.15 (6)
Min Solder Mask Bridge mm(mil)
Screen Print0.2 (8)0.2 (8)0.2 (8)
LPI0.1 (4)0.1 (4)0.1 (4)
Min Solder Mask Bridge mm(mil)
Screen Print0.15 (6)0.15 (6)0.15 (6)
LPI0.1 (4)0.1 (4)0.1 (4)
Min Pad to Pad Dimension Tolerance up to 16”±0.1 (4)±0.1 (4)±0.1 (4)
Max. Warpage (Bow & Twist)0.75%0.75%0.75%

Item201920202021
Sheet Size 1250*600mm 1250*600mm 1250*600mm 
Maximum Layers6L 8L 8L 
Minimum Metal Base Thickness0.4mm 0.3mm 0.3mm 
Maximum Metal Base Thickness5.0mm 5.0mm 5.0mm 
Minimum Thermal Conductive Layer Thickness0.038mm 0.038mm 0.038mm 
Thinnest Core Plate Thickness0.075mm 0.075mm 0.075mm 
Thermal Conductivity  1-8W/m.K 1-8W/m.K 1-8W/m.K 
Breakdown Voltage  5KVAC 6KVAC 6KVAC 
Minimum Inner Layer Trace Width / Spacing0.075/0.075mm0.075/0.075mm0.075/0.075mm
Minimum Outer Layer Trace Width / Spacing0.075/0.075mm0.075/0.075mm0.075/0.075mm
Maximum Copper Thickness6OZ 6OZ 6OZ 
Minimum Aluminum Based Drilling Hole Diameter0.55mm 0.55mm 0.55mm
Minimum Copper Based Drilling Hole Diameter  0.65mm 0.65mm 0.65mm 
Contour Tolerance  ±0.1mm±0.1mm±0.1mm
Special ProcessesCOB, Carved Cup, Copper Inlay, Pedestal, Resin Slot
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