High Density Interconnect PCBs (HDI)
Electronic Components Marketing Group
High density interconnect printed circuit boards (PCBs) excel in the size to functionality equation over multi-layer or double-sided PCBs. 
High density interconnect PCBs are found in applications such as Telecom Infrastructure, Mobile Phones, Tablets, Medical Scanning and highly complex Consumer Audio and Video applications. High density interconnect PCBs use laser formed microvias as well as blind and buried microvias to connect complex and compact circuitry through all layers of the PCB. HDI boards are smaller in size than conventional PCBs while offering more functionality.
Depending on your device’s needs, high density interconnect PCBs may be the right solution for you. Use the buttons below to request a quote or learn more about your PCB options.
Capabilities
| Product Feature | Technology Roadmap | ||
| 2017 | 2018 | 2019 | |
| Layer Count (Max) | 18L | 20L | 20L |
| Laminate & Prepreg | FR-4, HFFR-4 | FR-4, HFFR-4 High Speed / Low Loss Megtron 6 | FR-4, HFFR-4 High Speed / Low Loss Megtron 6 |
| Surface Finish | ENIG, OSP, Immersion Silver,Immersion Tin, Selective ENIG+OSP | ENIG, OSP, Immersion Silver,Immersion Tin, Selective ENIG+OSP | ENIG, OSP, Immersion Silver,Immersion Tin, Selective ENIG+OSP |
| HDI Level | 1+N+1 2+N+2 3+N+3 Anylayer | 1+N+1 2+N+2 3+N+3 Anylayer | 1+N+1 2+N+2 3+N+3 Anylayer |
| Max Board Thickness mm(mil) | 3.2 (126) | 3.2 (126) | 3.2 (126) |
| Min Board Thickness mm(mil) | 0.4 (16) | 0.4 (16) | 0.4 (16) |
| Min Core Thickness mm(mil) | 0.05 (2) | 0.05 (2) | 0.05 (2) |
| Min Dielectric Thickness mm(mil) | 0.05 (2) | 0.05 (2) | 0.05 (2) |
| Min Micro-via Size mm(mil) | 0.076 (3) | 0.076 (3) | 0.076 (3) |
| Min Microvia Pad Size mm(mil) | 0.2 (8) | 0.2 (8) | 0.2 (8) |
| Min Mechanical Drill Hole Size mm(mil) | 0.15 (6) | 0.15 (6) | 0.15 (6) |
| Press-fit Hole Tolerance (mm) | ±0.05mm | ±0.05mm | ±0.05mm |
| PTH Hole Tolerance (excluding HASL) (mm) | ±0.05mm | ±0.05mm | ±0.05mm |
| 14 NPTH Hole Tolerance (mm) | ±0.03mm | ±0.03mm | ±0.03mm |
| Hole Plating Aspect Ratio (max) | 8:01 | 9:01 | 9:01 |
| Micro-via Aspect Ratio | 0.85 : 1 | 1 : 1 | 1 : 1 |
| Min.Line Width & Spacing (mm) (Inner) | 0.070mm | 0.064mm | 0.064mm |
| Min.Line Width & Spacing (Outer) (mm) | 0.076mm | 0.076mm | 0.076mm |
| Min Mechanical Via Pad Size mm(mil) | 0.2 (D+8) | 0.2 (D+8) | 0.2 (D+8) |
| Image to Hole Tolerance mm(mil) | ±0.076 (3) | ±0.064 (2.5) | ±0.064 (2.5) |
| Hole to Edge Tolerance mm(mil) | ±0.100 (4) | ±0.076 (3) | ±0.076 (3) |
| Min Solder Mask Bridge mm(mil) | 0.076 (3) | 0.076 (3) | 0.076 (3) |
| Min Solder Mask Opening mm(mil) | 0.05 (2) | 0.05 (2) | 0.05 (2) |
| Controlled Impedance | ±8% | ±8% | ±7% |
| Min BGA Pitch mm(mil) | 0.45 (18) | 0.45 (18) | 0.45 (18) |
| Min Pad to Pad Dimension Tolerance up to 16” | ±0.05 (2) | ±0.05 (2) | ±0.05 (2) |
| Min Hole to Copper up to Max Layer Count mm(mil) | 0.178 (7) | 0.165 (6.5) | 0.165 (6.5) |
| Max. Warpage (Bow&Twist) | 0.40% | 0.40% | 0.40% |
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